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BGA6489
MMIC wideband medium power amplifier
Rev. 02 -- 15 June 2009 Product data sheet
1. Product profile
1.1 General description
The BGA6489 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic, low thermal resistance, SMD package. The BGA6x89 series of medium power gain blocks are resistive feedback Darlington configured amplifiers. Resistive feedback provides large bandwidth with high accuracy.
CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling.
1.2 Features
I I I I Broadband 50 gain block 20 dBm output power SOT89 package Single supply voltage needed
1.3 Applications
I I I I I I I I Broadband medium power gain blocks Small signal high linearity amplifiers Variable gain and high output power in combination with the BGA2031 Cellular, PCS and CDPD IF/RF buffer amplifier Wireless data SONET Oscillator amplifier, final PA Drivers for CATV amplifier
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
1.4 Quick reference data
Table 1. Symbol VD IS |s21|2 NF PL1dB Quick reference data Parameter DC device voltage DC supply current insertion power gain noise figure load power at 1 dB gain compression Conditions on pin 1; IS = 78 mA VS = 8 V; R1 = 39 ; Tj = 25 C f = 1950 MHz f = 1950 MHz f = 850 MHz f = 1950 MHz Min Typ 5.1 78 16 3.3 20 17 Max Unit V mA dB dB dBm dBm
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description RF_OUT/BIAS GND
3 1 2 3 2 1
sym130
Simplified outline
Graphic symbol
RF_IN
3. Ordering information
Table 3. Ordering information Package Name BGA6489 SC-62 Description plastic surface-mounted package; collector pad for good heat transfer; 3 leads Version SOT89 Type number
4. Marking
Table 4. BGA6489 Marking codes Marking code 4A Type number
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
2 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VD IS Ptot Tstg Tj PD
[1]
Parameter DC device voltage DC supply current total power dissipation storage temperature junction temperature maximum drive power
Conditions on pin 1; RF input AC coupled Tsp 70 C
[1]
Min Max -65 6 150 800 +150 150 15
Unit V mA mW C C dBm
Tsp is the temperature at the solder point of the ground lead, pin 2.
6. Thermal characteristics
Table 6. Symbol Rth(j-sp)
[1]
Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Tsp 70 C
[1]
Typ 100
Unit K/W
Tsp is the temperature at the solder point of the ground lead, pin 2.
7. Characteristics
Table 7. Static characteristics VS = 8 V; Tj = 25 C; Rbias = 39 [1] Symbol Parameter VD IS
[1]
Conditions on pin 1; IS = 78 mA
Min 70
Typ 5.1 78
Max Unit 86 V mA
DC device voltage supply current
VS = DC operating supply voltage applied to Rbias; see Figure 10
Table 8. Characteristics VS = 8 V; IS = 78 mA; Tamb = 25 C; IP3(out) tone spacing = 1 MHz; PL = 0 dB per tone, Rbias = 39 ; ZL = ZS = 50 ; unless otherwise specified; see Figure 10. Symbol Parameter |s21|2 Insertion power gain Conditions f = 850 MHz f = 1950 MHz f = 2500 MHz RLIN return losses input f = 850 MHz f = 1950 MHz f = 2500 MHz RLOUT return losses output f = 850 MHz f = 1950 MHz f = 2500 MHz Min Typ 20 16 15 14 16 19 16 12 10 Max Unit dB dB dB dB dB dB dB dB dB
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
3 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
Table 8. Characteristics ...continued VS = 8 V; IS = 78 mA; Tamb = 25 C; IP3(out) tone spacing = 1 MHz; PL = 0 dB per tone, Rbias = 39 ; ZL = ZS = 50 ; unless otherwise specified; see Figure 10. Symbol Parameter NF noise figure Conditions f = 850 MHz f = 1950 MHz f = 2500 MHz K PL1dB IP3(in) IP3(out) stability factor load power at 1 dB gain compression input intercept point output intercept point f = 850 MHz f = 2500 MHz f = 850 MHz f = 1950 MHz f = 850 MHz f = 2500 MHz f = 850 MHz f = 2500 MHz Min Typ 3.1 3.3 3.4 1.2 1.3 20 17 13 12 33 27 Max Unit dBm dBm dBm dBm dBm dBm dB dB dB
90 +1 135 +0.5 +2 45 1.0 0.8 0.6 0.4 0.2 180 0 0.2 0.5 2.6 GHz 200 MHz 2 5 10 0 0
+0.2
+5
-0.2
-5
-135
-0.5 -1 -90
-2
-45 1.0
mgx400
IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 .
Fig 1.
Input reflection coefficient (s11); typical values
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
4 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
90 +1 135 +0.5 +2 45 1.0 0.8 0.6 0.4 0.2 180 0 0.2 0.5 1 2 200 MHz 5 10 0 0
+0.2 2.6 GHz
+5
-0.2
-5
-135
-0.5 -1 -90
-2
-45 1.0
mgx401
IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 .
Fig 2.
Output reflection coefficient (s22); typical values
25
|s21|2 (dB)
mgx403
0
|s12|2 (dB)
mgx402
20
-10
15 -20 10 -30 5
0 0 500 1000 1500 2000 2500 f (MHz)
-40
0
500
1000
1500
2000 2500 f (MHz)
IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 .
IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 .
Fig 3.
Insertion power gain frequency; typical values
(|s21|2)
as a function of
Fig 4.
Isolation (|s12|2) as a function of frequency; typical values
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
5 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
25 PL1dB (dBm) 20
mgx404
40 IP3(out) (dBm) 30
mgx405
15 20 10
10 5
0 0 500 1000 1500 2000 2500 f (MHz)
0 0 500 1000 1500 2000 2500 f (MHz)
IS = 78 mA; VS = 8 V; ZO = 50 .
IS = 78 mA; VS = 8 V; ZO = 50 .
Fig 5.
Load power as a function of frequency; typical values
Fig 6.
Output intercept as a function of frequency; typical values
5 K 4
mgx407
5 NF (dB) 4
mgx406
3
3
2
2
1
1
0 0 500 1000 1500 2000 2500 f (MHz)
0 0 500 1000 1500 2000 2500 f (MHz)
IS = 78 mA; VS = 8 V; ZO = 50 .
IS = 78 mA; VS = 8 V; ZO = 50 .
Fig 7.
Stability factor as a function of frequency; typical values
Fig 8.
Noise figure as a function of frequency; typical values
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
6 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
100 Is (mA) 90
mgx408
80
70
60 -40
-20
0
20
40
60 80 Tj (C)
VS = 8 V; Rbias = 39 .
Fig 9. Supply current as function of operating junction temperature; typical values
8. Application information
Figure 10 shows a typical application circuit for the BGA6489 MMIC. The device is internally matched to 50 and therefore does not require any external matching. The value of the input and output DC blocking capacitors C1 and C2 depends on the operating frequency; see Table 9. Capacitors C1 and C2 are used in conjunction with L1 and C3 to fine tune the input and output impedance. Capacitor C4 is a supply decoupling capacitor. A 1 F capacitor (C5) can be added for optimum supply decoupling. The external components should be placed as close as possible to the MMIC. When using via holes, use multiple via holes per pin in order to limit ground path induction. Resistor R1 is a bias resistor providing DC current stability with temperature.
R1(2)
VS
C3 L1 50 microstrip 50 microstrip C4 C5(1)
C1
3 2
1
VD C2
mgx419
(1) Optional capacitor for optimum supply decoupling. (2) R1 values at operating supply voltage: VS = 6 V; R1 = 27 . VS = 8 V; R1 = 39 . VS = 11 V; R1 = 82 .
Fig 10. Typical application circuit
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
7 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
Table 9. List of components See Figure 10 for circuit. Component Description C1, C2 C3 C4 C5[1] L1 R1
[1] Optional.
Package 0603 0603 0603 0603 0603 -
Value at operating frequency 500 MHz 800 MHz 100 pF 68 pF 1 nF 1 F 33 nH 39 1950 MHz 2400 MHz 3500 MHz 68 pF 22 pF 1 nF 1 F 22 nH 39 56 pF 22 pF 1 nF 1 F 18 nH 39 39 pF 15 pF 1 nF 1 F 15 nH 39 220 pF 100 pF 1 nF 1 F 68 nH 39
multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor electrolytic or tantalum capacitor SMD inductor SMD resistor 0.5 W; VS = 8 V
8.1 Scattering parameters
Table 10. Scattering parameters IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 ; Tamb = 25 C f (MHz) s11 Magnitude (ratio) 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600
BGA6489_2
s21 Angle (degree) 28.11 27.41 21.64 15.28 8.01 0.34 -7.27 -14.78 -22.18 -29.33 -36.41 -42.47 -49.06 -55.46 -61.20 -67.02 -73.40 -78.99 -84.54 -91.32 -97.58 -103.60 -111.90 -120.80 -129.80 Magnitude (ratio) 12.79 12.59 12.31 11.97 11.57 11.18 10.75 10.24 9.80 9.40 8.96 8.53 8.16 7.85 7.51 7.16 6.90 6.69 6.42 6.16 5.99 5.83 5.58 5.39 5.30 Angle (degree) 164.42 156.85 149.28 141.88 134.79 127.97 121.56 115.06 109.18 103.40 98.12 92.76 87.50 82.76 78.52 74.16 69.37 65.14 61.15 56.80 52.55 49.08 45.43 40.67 36.66
s12 Magnitude (ratio) 0.06 0.06 0.06 0.06 0.06 0.06 0.05 0.05 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.07 0.07 0.07 0.08 0.08 Angle (degree) -0.30 -0.39 -0.35 -0.32 0.04 0.63 1.57 1.85 3.16 4.29 5.64 7.03 7.74 9.08 10.76 11.89 12.34 13.16 14.33 14.84 15.05 15.72 15.96 15.27 14.68
s22 Magnitude (ratio) 0.12 0.13 0.14 0.14 0.15 0.16 0.16 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.16 0.16 0.16 0.16 0.16 0.17 0.17 0.19 0.20 0.22 0.24 Angle (degree) -22.91 -35.38 -46.54 -57.20 -61.41 -76.76 -85.75 -94.28 -102.4 -110.3 -118.5 -126.7 -134.8 -143.5 -152.7 -161.8 -171.9 177.4 166.81 156.07 145.29 135.65 126.23 117.16 110.35
K
0.06 0.09 0.11 0.12 0.14 0.16 0.17 0.18 0.19 0.20 0.21 0.21 0.22 0.22 0.22 0.22 0.21 0.21 0.20 0.19 0.18 0.17 0.16 0.14 0.13
1.1 1.1 1.1 1.1 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
8 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
Table 10. Scattering parameters IS = 78 mA; VS = 8 V; PD = -30 dBm; ZO = 50 ; Tamb = 25 C f (MHz) s11 Magnitude (ratio) 2700 2800 2900 3000 3100 0.13 0.12 0.11 0.11 0.12 Angle (degree) -143.80 -154.47 -164.40 178.65 160.01 s21 Magnitude (ratio) 5.18 5.08 4.71 4.66 4.45 Angle (degree) 33.88 30.28 22.43 18.90 18.63 s12 Magnitude (ratio) 0.08 0.08 0.09 0.09 0.10 Angle (degree) 15.64 15.56 11.60 11.05 10.63 s22 Magnitude (ratio) 0.28 0.31 0.28 0.31 0.33 Angle (degree) 104.05 97.10 91.75 84.80 80.37 1.3 1.3 1.3 1.3 1.3 K
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
9 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
9. Package outline
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89
D
B
A
bp3
E
HE
Lp 1 2 bp2 wM B bp1 e1 e 3 c
0
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.6 1.4 bp1 0.48 0.35 bp2 0.53 0.40 bp3 1.8 1.4 c 0.44 0.23 D 4.6 4.4 E 2.6 2.4 e 3.0 e1 1.5 HE 4.25 3.75 Lp 1.2 0.8 w 0.13
OUTLINE VERSION SOT89
REFERENCES IEC JEDEC TO-243 JEITA SC-62
EUROPEAN PROJECTION
ISSUE DATE 06-03-16 06-08-29
Fig 11. Package outline SOT89 (SC-62)
BGA6489_2 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
10 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
10. Abbreviations
Table 11. Acronym CDPD IF PCS SMD SONET Abbreviations Description Cellular Digital Packet Data Intermediate Frequency Personal Communication Service Surface Mount Device Synchronous Optical NETwork
11. Revision history
Table 12. Revision history Release date 20090615 Data sheet status Product data sheet Change notice Supersedes BGA6489_1 Document ID BGA6489_2 Modifications:
* * * * * * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Changed IS from 74 mA to 78 mA throughout. Table 1: changed symbol VS to VD. Table 5: changed symbol VS to VD and added "on pin 1;" to Conditions. Table 7: added row for VD DC device voltage. Section 8: added sentence. Table 9: added 39 to all value columns for resistor R1. Table 9: amended values of C3 and C4. Product data sheet -
BGA6489_1
20030918
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
11 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA6489_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 15 June 2009
12 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 7 Scattering parameters . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 June 2009 Document identifier: BGA6489_2

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